About FusionAP Sdn. Bhd.
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Advancing the Future of Semiconductor Packaging
FusionAP is a Malaysia-based advanced semiconductor packaging company delivering next-generation 2.5D, 3D, and beyond-Moore solutions by combining chiplet architectures, advanced interconnects, and system-level optimisation into scalable, manufacturable designs.
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A Collaborative Advanced Packaging Ecosystem
FusionAP works within a collaborative ecosystem—partnering with fabless companies, design houses, foundries, and technology suppliers—to align design, packaging, and test from the outset, accelerating the path from prototype to production while reducing risk and time-to-market.
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From Prototype to High-Volume Manufacturing
FusionAP partners closely with technology leaders to translate R&D breakthroughs into manufacturable, high-yield, production-ready advanced packaging solutions—enabling confident deployment at scale.
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Geographic Neutrality as a Competitive Strength
Based in Malaysia's stable, geopolitically neutral environment, FusionAP delivers trusted advanced semiconductor packaging with deep expertise, strong infrastructure, and global reach across Asia, the United States, and Europe.
Our Investors
Backed by leading regional investors supporting Malaysia's advanced packaging journey.
Our Services
FusionAP delivers specialized advanced packaging solutions — from wafer bumping and advance substrate design & simulation, through 2.5D/3D heterogeneous integration, rapid prototyping, and assembly & test — purpose-built to take high-performance semiconductor products from concept to volume manufacturing.
Engineering Services
Engineering services to support advanced packaging process development and technology integration for HVM semiconductor manufacturing lines.
Prototyping & Engineering Samples
Rapid prototyping and engineering sample builds to validate designs, materials, and processes before volume production.
Advance Substrate Design & Simulation
Substrate design and simulation services covering electrical, thermal, and mechanical performance to reduce risk and improve reliability early in development.
Wafer Bumping
High‑density wafer bumping capability to support reliable die‑to‑package interconnects optimized for performance, power, and manufacturability.
2.5D & 3D Heterogeneous Integration
Advanced 2.5D and 3D packaging solutions enabling chiplet‑based architectures, high‑bandwidth interconnects, and heterogeneous integration.
Assembly & Test
Advanced assembly and test services focused on quality, yield learning, and smooth transition from prototype to high‑volume manufacturing.
Team
FusionAP is led by a team of industry veterans aiming to establish Malaysia's first domestic Advance Packaging capability.
23 years at Altera and Intel across IC Design, Product Test Engineering, and Advanced Packaging Program Management — last serving as Senior Program Director for Advanced Packaging at Intel Malaysia. Now leads FusionAP's vision for geopolitically neutral advanced packaging.
Ooi Teng Chow
Co-Founder & CEO
Former Intel Corporate VP and GM of the Disaggregation Manufacturing Organization — led HVM for Foveros and EMIB 3D packaging. Previously GM of Fab-Sort Manufacturing across multiple process nodes. Brings decades of fab and packaging execution expertise to FusionAP.
Peter Charvat
Co-Founder & Advisor
27+ years across Intel, ams OSRAM, Infineon, Silterra, and Micron — covering wafer-fab startups, tech transfers, and HVM ramps. Deep process expertise in PVD, CVD, epitaxy, dry etch, ALD, CMP, C4 bumping, and TSV.
Ooi Soo Ee
Engineering Director
25+ years in failure analysis, manufacturing, and product development. At Intel, manufacturing architect for SoC, Graphics, and 5G — key contributor to 3DIC programs (Lakefield, Ponte Vecchio). At TSMC, developed in-line testing methodology for Advanced Packaging.
Cheah Sook Kwan
Test Technologist
25+ years across ODM/OEM, EMS R&D, and development engineering. Led two greenfield startups and a brownfield expansion. Most recently key in building AT&S's largest Malaysian substrate footprint for 2.5D/3D heterogeneous integration in AI data centre workloads.
Allen Cheah
Substrate Integration Technologist
30+ years of global semiconductor leadership across the US and Asia. Deep expertise in FCXGA backend assembly, quality systems, yield improvement, NPI transfer, and advanced packaging design — bringing complex technologies into production.
Ken Yong
MD of FusionAP SolutionsNews & Updates
Stay up to date with the latest announcements, milestones, and developments from FusionAP as we grow Malaysia's advanced packaging ecosystem.
Malaysian advanced semiconductor packaging company FusionAP raises $2M
Backscoop reports FusionAP's US$2M pre-seed led by Vertex Ventures SEA & India and Southern Capital Group, backing a geopolitically neutral OSAT for global chipmakers.
Read MoreMalaysia's FusionAP raises $2M to expand advanced semiconductor packaging
TechNode Global covers the US$2M raise from Vertex Ventures and Southern Capital Group to fund engineering, R&D, and pilot production for FusionAP's 2.5D/3D OSAT platform.
Read MoreVertex co-leads $2M into Penang chip startup FusionAP
Tech in Asia reports on FusionAP's pre-seed round co-led by Vertex Ventures, supporting Malaysia's advanced packaging ambitions.
Read MoreGovt bets on five local semiconductor companies capturing 7% of global advanced packaging market by 2035
The Edge Malaysia reports Mosti's RM92M R&D grant to five companies forming the Malaysia Advanced Packaging Consortium (MAPC), with FusionAP among the named players.
Read MoreMalaysia wants 7% of the global advanced packaging market by 2035
TechWire Asia covers the MAPC consortium's plan to target HBM4 memory production and the funding and anchor-customer challenges ahead.
Read MoreLate chip packaging bet may finally pay off
The Star profiles FusionAP as Malaysia's first domestic advanced packaging OSAT, leveraging geopolitical neutrality and cost competitiveness to win underserved segments.
Read MoreMalaysia eyes advanced chip packaging push, but execution risks keep outlook neutral — HLIB
The Edge Malaysia reports Hong Leong Investment Bank's view that Malaysia's semiconductor sector could see a structural upgrade through advanced packaging, while flagging execution risks.
Read MoreFusionAP emerges as Malaysia's bet on advanced packaging breakthrough
Focus Malaysia profiles FusionAP — founded 2025 — as Malaysia's first homegrown advanced packaging provider, positioning as a neutral partner for global chipmakers within the MAPC consortium.
Read More
Careers
"Where Talent Meets Opportunity — reach out to us to start your journey."
Contact Us
Whether you're looking to explore a partnership, discuss a packaging challenge, or simply learn more about what we do — we'd love to hear from you. Reach out to the FusionAP team and let's start a conversation.
Location:
02-05, NCER Technology Innovation Centre (NTIC),
Plot 36, Hilir Sungai Keluang 2,
Bayan Lepas Industrial Park,
Phase 4, 11900 Bayan Lepas, Penang, Malaysia
Email:
info@FusionAP.com